3D InCites Grows Up: Passing the Torch
While raising my daughters, I ascribed to the philosophy: “A parent’s charge – give them roots and give them wings.” I believe this also applies to brainchildren. At some point, your work is done, and...
View ArticleClik here to view.
Passing the Torch: Reflections from SEMICON Europa 2025
Vintage EVG Swag from 2007. They need to bring this one back. While announcing my retirement after 20 years in the industry at IMAPS Symposium brought my career in advanced packaging full circle,...
View ArticleFrancoise Unfiltered: Thoughts from IMAPS Symposium and SEMICON West
Maybe it’s my impending retirement, but I’m feeling a little salty these days. This my fifth draft about the highlights, low-lights and Aha moments of both IMAPS Symposium and SEMICON West. And I can’t...
View ArticleChanges at 3D InCites: Here’s What You Need to Know
I recently realized that IMAPS Symposium 2025 marks my 20th anniversary in the microelectronics industry. It was the first industry event I attended, as the Associate Editor of Advanced Packaging...
View ArticleClik here to view.
IMAPS Executive Summit: Advanced Packaging Comes to Silicon Valley
To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help of the local committee and the IMAPS team – the first ever IMAPS...
View ArticleClik here to view.
ECTC 2025 Celebrates Seventy-five Years of Pushing the Connectivity Scale
Seventy-five years is a long time. Fireworks often light up the sky to celebrate such significant milestones. How fitting it was, then, for the 75th Anniversary Celebration of the IEEE Electronics...
View ArticleClik here to view.
Arizona: The Epicenter of Semiconductor Resurgence
Katie Hobbs, Governor, Arizona Whether we start calling it Chip Canyon, the Silicon Zone, or Silicon Diyógí (say Dare-yo-ghee), it looks like Arizona is on track for becoming the epicenter of...
View ArticleA Tribute to Paul Werbaneth: Friend and Colleague
Earlier this month, in the middle of the IMAPS Device Packaging Conference Welcome Reception, I got an upsetting text from a fellow SemiSister, Jane Evans-Ryan, founder and principal of Genuity PR,...
View ArticleClik here to view.
Will the CHIPS ACT Be “DOGE’d?” And Other Musing from IMAPS Device Packaging...
There was a lot to be enthusiastic about at IMAPS Device Packaging 2025 (DPC2025). We presented the 2025 3D InCites Awards to eight deserving winners. We donated $70K to the IMAPS Microelectronics...
View ArticleClik here to view.
Announcing the Winners of the 2025 3D InCites Awards
As advanced interconnect and advanced packaging processes take the helm to drive advancements in next generation semiconductor devices, innovation and collaboration across the microelectronics supply...
View ArticleInterconnectology Saves the World!
In 2007, when I was managing editor at the now defunct Advanced Packaging Magazine, we went out on a limb in our January Industry Forecast to declare, as our cover story: Advanced Packaging Saves the...
View ArticleClik here to view.
The 3D InCites Podcast Backtrack – 2024 in Review
Buzzsprout, the platform where the 3D InCites podcast lives, does a cool thing at the end of the year. It provides the podcast backtrack – a recap of your stats, including the top performing episodes....
View ArticleClik here to view.
Catching Up on The Latest in Advanced Packaging at SEMICON Europa 2024
Now that imec’s Luc Van den hove declared advanced packaging is key to the advancement of semiconductors, everyone in the industry needs to catch up to those who have been following the course of these...
View ArticleClik here to view.
Making Connections at SEMICON Europa 2024
Let’s be honest. When we get home from a trade show like SEMICON Europa 2024, it’s not all the presentations that we remember. It’s the connections we’ve made – new and old – with industry colleagues...
View ArticleClik here to view.
Picking up the Pace of Panel-level Advanced Packaging at Onto Innovation
How A Collaborative Partnership Is Accelerating PLP Innovation Panel-level advanced packaging technologies have been in development for more than a decade. They began as a way to reduce costs and...
View ArticleClik here to view.
Leaning Into Interconnectology – Musings from IMAPS Symposium 2024
Call me crazy, but after spending three days at the 2024 International Microelectronics and Packaging Society (IMAPS) Symposium in Boston learning about the latest industry trends and technology...
View ArticleClik here to view.
ASU’s SWAP Hub and National Collaborations Shape U.S. Microelectronics...
In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira Fulton School of Engineering at Arizona State University (ASU). At the time,...
View ArticleClik here to view.
Tapping into the Power of the Microelectronics Community
In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far, I’ve attended lunch at Amkor Technology and more...
View ArticleClik here to view.
Community Member Conversations from IMAPS 2023
John Lannon(L), Rex Anderson, (R) Micross. At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics of the day. They shared their opinions on...
View ArticleClik here to view.
IMAPS Keynotes Focus on Heterogeneous Integration for HPC, AI, and EVs
This year’s IMAPS keynotes focused on advancements in heterogeneous integration (HI) technologies and chiplet architectures enabled by HI, driven by the needs of high-performance computing, AI, and...
View Article
![[-100%] Commodity Intelligence – (Android Apps)](http://play-lh.googleusercontent.com/j67-qJvmnn4xnVlYVZ9ZhtZUJIgwjKekJGoKQT6D1KHcWGZxtQaFroummEvwV17na7tyh1pGbbeWCRdWtTKqeg=w950-h950)
