With the Potential to Save Lives, Smart Rock Bolt Takes Home the IPSO...
Now in its third year, the IPSO CHALLENGE 2015, an annual event run by the IPSO Alliance, requires entrants to showcase how they use Internet Protocol (IP) and open standards in building devices for...
View ArticleHappy Holidays, from your friends at 3D InCites!
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At 3D ASIP 2015, Variety is the Spice of Life
Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s been laser-focused on one emerging segment since its...
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3D ASIP 2015: 3D Manufacturing Processes from the Early Days to the Present
For the first time since the 3D Architectures for Semiconductor Integration and Packaging (3DASIP) Conference was established, the organizing committee decided to acknowledge the work of two...
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The European 3D Summit: From Roadmaps to Reality
In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected the shift from R&D to the real business of 3D integration and advanced packaging,...
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European 3D Summit: Market Analysts Weigh in on FOWLP, 3D Packaging, and SiP
As it has in year’s past, the 2016 European 3D Summit kicked off with a market briefing. We heard from the usual suspects: Yole Dévéloppement (Rozalia Beica) and TechSearch International Inc. (Linda...
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The European 3D Summit: The Gala Quiz
Hands-down, the best part of last week’s 2016 European 3D Summit was the Gala Dinner at the Chateau Sassenage, and in particular, the Gala Quiz. (I think my co-attendees would agree with me.) I applaud...
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European 3D Summit: Putting 3D Packaging To Work
Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging — add value to the devices in which they are...
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Success for 3D: What A Difference a Year Makes
During the 2015 European 3D TSV Summit, I drove attendees to distraction by asking each presenter what success looked like to them for 3D integration. The resulting responses became a blog post, What...
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From the Ashes of Moore’s Law: More than Moore Has Arrived
Now that the industry has finally called it a day for Moore’s law, will More than Moore be our guiding star for innovation? Analysts have been predicting the demise of Moore’s law for about as long as...
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The HBM Supply Chain is Open for Business!
Last June, AMD made 3D integration history with its introduction of the Fiji gaming processor unit (GPU), which for the first time put high bandwidth memory (HBM) — a true 3D stack integrating memory...
View ArticleSystem-in-Package was the Big Story at IMAPS DPC 2016
“The sum is greater than the whole of its parts.” ~ Aristotle (and Bill Chen) While the technology tracks offered the latest developments in interposer and 3D IC processes, fan-out, wafer-level...
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EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016
This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number of interesting areas of importance to the advanced packaging community. I...
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Advanced Packaging and 3D come to MRS Spring Meeting
For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never attended this event, as it is deeply academic, and has not been on my radar for...
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IPSO Challenge Update: The Smart Rock Bolt Success Story
Six months ago, I interviewed Jens Eliasson, associate professor at Luleå University of Technology (LTU), and co-developer of the Smart Rock Bolt, a vibration-sensor-based device used for instrumenting...
View ArticleECTC 2016: Memory Technology Advances and Prospects for Packaging
At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled, Memory Technology Advances and Prospects for Packaging may have been one of...
View ArticleWords of Advice From Successful Women in Advanced Packaging
For the second consecutive year, Beth Keser, Qualcomm, organized and moderated the CMPT Woman’s Panel and Reception as part of ECTC’s special sessions. This year’s topic was titled, Maximize your...
View ArticleECTC 2016: Is the Life after Moore’s Law?
Is Moore’s Law dead or not? It depends on your perspective. Last week at ECTC 2016, Rozalia Beica, Dow Electronic Materials, gathered a prestigious group of senior executives from the world’s leading...
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Supplier Updates from ECTC 2016
In addition to attending the panel and plenary sessions at ECTC 2016, which took place May 31-June 3, 2016, I also spent a good deal of time talking to industry suppliers to get updates on their latest...
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Executive Viewpoint: The New Advanced Packaging Landscape
You might recall that a few year’s back (October 2013, to be precise), 3D InCites’ regular blogger, Paul Werbaneth, had the opportunity to interview Dongkai Shangguan, then CEO of the National Center...
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