The Heterogenous Integration Roadmap Committee wants to create a new nomenclature that does away with 2.5D. Instead, the industry will refer to 2D, 2D enhanced (formerly 2.5D) and 3D architectures. 2D enhanced will be further categorized as 2DS (silicon substrate) or 2DO (organic substrate).
We want to know your opinion. Please vote below.
Find out more about the new nomenclature here. For more on the heterogeneous integration roadmap, read this interview with Bill Chen.
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