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Beyond the Smartphone: How Digital Imaging is Becoming Ubiquitous
Figure 1: OmniVision was awarded one of two 3D InCites Device of the Year awards for its OS05A20 Image Sensor with Nyxel Technology. Digital imaging has come a long way since its first consumer...
View ArticleBitcoin and Beanie Babies: Why Cryptocurrency Volatility Matters to the...
Bitcoin, a cryptocurrency built on blockchain, has become one of the hottest topics to hit the semiconductor news feeds and the conference circuit since the iPhone. Why? Because this code-based...
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ECTC 2018 Paves the Path to Heterogeneous Integration
For nine years, my fellow 3D InCites bloggers and I have been evangelizing about the wonders the microelectronics industry can achieve with innovations in 3D, advanced packaging, and other...
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The Heterogeneous Integration Roadmap Explained by Bill Chen
ASE’s Bill Chen and Patricia McLeod enjoying the Keynote Luncheon at ECTC 2018. Festivities at ECTC 2018 kicked off May 29, 2018, with a full-day Heterogeneous Integration Roadmap (HIR) Workshop. This...
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Fan-out is Hot, 3D Is Back, and 5G is Needed: The Inside Scoop from ECTC 2018
There’s fact, and there’s perception. The messages people carry away from conferences are not only influenced by what they hear from the speakers, but also from the conversations they have with their...
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Special ECTC 2018 Session Focuses on Frontiers in Assembly Technology
The special Tuesday session at ECTC 2018 took a look at new methods and applications for assembly technology to accommodate the needs of heterogeneous integration at the system level. The session was...
View ArticleCo-Design Comes to ECTC 2018: You Can Lead A Horse to Water…
Despite a valiant effort by the ECTC committee to integrate design topics into this year’s agenda, the number of empty seats spoke volumes: Including two plenary sessions on design-focused topics was...
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Tech Round-up from ECTC 2018
For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather than the technology corner, as part of our media trade. We consider it to be prime real...
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Transforming the Fan-out Landscape
These days, the first thing that comes to mind when someone mentions fan-out (FO) technology is Apple’s A10 processor built on TSMCs integrated fan-out (InFO) technology. It’s the superstar application...
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An Update on the Fan-out Panel-Level Packaging Consortium
Figure 1: Fraunhofer IZM 2018 3D InCItes Research Institute of the Year. One topic that has been under hot debate in the semiconductor advanced packaging sector for the past few years is fan-out...
View ArticleAre you Team 3D, 2.5D or 2DS/2DO?
The Heterogenous Integration Roadmap Committee wants to create a new nomenclature that does away with 2.5D. Instead, the industry will refer to 2D, 2D enhanced (formerly 2.5D) and 3D architectures. 2D...
View Article3D InCites Top Picks for SEMICON West 2018
Ok folks. It’s that time of year again. SEMICON West 2018 is upon us. By the time you read this – IF you get the time to read this – it’s almost curtain time. Everything that needs to be prepped is...
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SEMICON West 2018: Smart Starts Where?
Well, that was interesting. SEMICON West 2018 just wrapped up, and I’m not quite sure what just happened. This year’s event was…. For lack of a better word… different. All I could think of as I looked...
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What Should Replace “2.5D” in the Heterogeneous Integration Nomenclature?
The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should keep it simple. When it comes to heterogeneous integration...
View ArticleWhy We need Lower Cost TSVs and How to Get Them
Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between dies at extremely low power dissipation. Used for years in...
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Volumes Matter and Other Conversations from SEMICON West 2018
The world wants intelligence in everything, especially things that aren’t nailed down like autonomous cars, and the internet of things (IoT) devices. And suddenly, semiconductors are the hottest game...
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It’s not the Data, it’s what you DO with it; and Other Conversations from...
Emerging technologies like artificial intelligence (AI), machine learning (ML) are driving more than just the semiconductor market. They also drove the conversations I had with everyone I spoke with at...
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How Jessica Gomez Short-Circuited Her Way to CEO: A SemiSister Success Story
The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US are women. For racial diversity, the...
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Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor...
Thomas Fries, CEO FRT, accepts the 3D InCites Award outside the FRT cleanroom. It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As...
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Why Today’s Advanced Packages Need Better Inspection and What’s Being Done...
It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving smaller nodes, the focus has shifted to advanced packaging and heterogeneous...
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