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European Imaging and Sensors Summit: It’s Not Just About Pretty Pictures Anymore
Figure 1: According to Gartner, by 2020 Image Image-based sensors will be the single largest category for IoT sensing. There’s no doubt about it. Imaging sensor technologies have come a long way since...
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Panel Level Packaging: The Next Sleeping Giant? And Other Thoughts From IWLPC...
To the best of my recollection (and a quick search through 3D InCites’ archives) the panel level packaging (PLP) hoopla first hit the conference circuit in 2015 at the International Wafer Level...
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Smart Factories: Is the Semiconductor Industry Practicing What it Preaches?
I’ve often found it somewhat ironic that those responsible for dreaming up and building the technologies that made smart devices, cities, cars, and factories possible, are often the slowest to adopt...
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Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)
One of the things I like best about the annual MEMS and Sensors Executive Congress (MSEC17) hosted by SEMI-MSIG, is being in the presence of some of the greatest minds in the industry. While the...
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Technical Tidbits from IWLPC and MSEC 2017
It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors...
View ArticleSEMICON Europa 2017: Connect, Collaborate, Innovate, Grow and Prosper
I remember the day I became Queen of 3D like it was yesterday: It was 2007 and I was attending my very first SEMICON Europa, which was held in Stuttgart, Germany. At the time, I was managing editor of...
View ArticleThe Future of Automotive Electronics from the European Perspective
From the keynotes to the sessions to casual conversation, automotive electronics was a hot topic of discussion at SEMICON Europa 2017. That’s likely because Europe leads the world in automotive OEMs...
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When It Comes to Robots and AI, We Draw the Line at Beer
As one of the current key drivers of the semiconductor industry, the development of robots with artificial intelligence has been on my mind quite a bit recently, second only to autonomous vehicles. I...
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The Truth About Moore’s Law is Revealed at 3D ASIP 2017
I’ve long held the belief that when it comes to reading scholarly works, very few people read the entire paper. At best, they read the title, introduction, and conclusion. At most, they skim the rest....
View ArticleHoliday Greetings from 3D InCites!
Did you ever wonder how much easier Christmas Eve would be for Santa in a world enabled by heterogeneous integration? This video shows our vision. Enjoy! Warm wishes for a Merry Christmas and Happy...
View ArticleNotes from SEMI’s ISS 2018, Day One
SEMI’s Industry Strategy Symposium (ISS) has been on my conference bucket list for some time, so when I was offered a press pass to attend ISS 2018, there was no question about attending. One day in,...
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Notes from SEMI’s ISS 2018, Days 2 and 3
The remaining two days of SEMI’s ISS 2018 dawned foggy and damp, making it a heck of a lot easier to head to the ballroom for a day and half full of inspiring talks versus ditching it all to answer the...
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Living the Dream at SEMI’s Industry Strategy Symposium
As I noted in my day one coverage of SEMI’s Industry Strategy Symposium (ISS 2018), which took place last week at the Ritz-Carleton Hotel in Half Moon Bay, CA, this was the first time I’d been invited...
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Announcing the Winners of the 2018 3D InCites Awards
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and hosted by iMAPS. This may have been the most exciting awards year yet, with 40 nominees...
View Article2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM...
March 7, 2018, the day of the 2018 3D InCites Awards Ceremony, dawned chillier than normal for this time of year in Fountain Hills, AZ. As they enjoyed their breakfast on the terrace outside the...
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Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS...
While Jeff Catlin, EMD; Steve Lemons, Collabratech; Dave Wenman, Pall; and Martijn Pierik, of Kiterocket (not pictured) took home the first place trophy at the iMAPS Foundation Golf Tournament, 3D...
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Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving...
How does the innovation of self-driving cars affect the business world we live in? This was the topic the iMAPS Global Business Council (GBC) chose to explore during its spring meeting two weeks ago,...
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Hybrid Bonding: From Concept to Commercialization
Hybrid bonding is quickly becoming recognized as the preferred permanent bonding path for forming high-density interconnects in heterogeneous integration applications, from 2DS enhanced, to 3D stacking...
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Getting IC Package Design Right the First Time
Two of Mentor’s six 3D InCites Awards from over the years. Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated as it...
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There’s a Fan-out for That
Ron Huemoeller, Corporate VP and Head of R&D at Amkor Technology Inc. Long gone are the days of the “killer app” and the notion that a single device market like personal computers (PCs) or...
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