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MEMS, Imaging, and Sensors Summits Show The Power of Collaboration
Last week, at the co-located 2018 European MEMS and Sensors/Imaging and Sensors Summits, held in Grenoble, France, I had the pleasure of gathering with 380 attendees from 21 companies from around the...
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Will Fully-Autonomous Vehicles Ever Take Over Our Roads?
At the 2018 European MEMS, Imaging and Sensors Summits, I detected a shift in sentiment around the likelihood (and the feasibility) that fully-autonomous vehicles are poised to take to the roads in the...
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3D VLSI is the New Active Interposer
3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on the scene as monolithic 3D (M3D), or as Leti dubbed it: sequential...
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Ain’t No Mountain High Enough to Keep Rozalia Beica From Success
“Driven” doesn’t even begin to describe Romanian-born Rozalia Beica, global director, strategic marketing, DowDupont. Neither rain, nor sleet, nor whizzing bullets overhead can keep this SemiSister...
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Dr. Phil Garrou Makes the Move to 3D InCites
Phil helped celebrate the 2018 3D InCItes Awards last March. Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites as contributing editor and as a...
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How Do We Create Smart Cities Without Exploiting Personal Data?
Claus Habfast, vice-chair, Grenoble-Alps Metropolitan Council, describes Grenoble’s smart city vision. Creating smart cities while also protecting the personal data of its citizens is no easy task...
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Hello, Microelectronics and Packaging? Your Opportunities are Calling
There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the semiconductor industry. With exciting markets like artificial intelligence (AI), 5G, and the...
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Bridging the Interconnect Pitch Gap Calls for 3D Technologies
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s Tien Wu during his IMAPS Symposium keynote earlier this month: High-performance...
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Talking Nerdy with Exhibitors at IWLPC 2018
With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process and equipment suppliers have...
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MSEC 2018 Keynote Speaker Examines the Growing Importance of Cybersecurity
Just over a year ago, Napa Valley was in flames, and the annual MEMS and Sensors Executive Congress (MSEC) had to be relocated from the Silverado Resort and Spa, located on the fringes of the Atlas...
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The MSEC 2018 Technology Showcase: Who Owns the Data?
The competition was fierce and the stakes high for the annual MSEC 2018 technology showcase. which took place during the MEMS and Sensors Executive Congress, in Napa CA. The winner gets a free table...
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Closing Out My 2018 Conference Season With SEMICON Europa and Electronica
In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS and sensors, two on advanced packaging, and one that tied everything all together. At...
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Seen on the Scene at SEMICON Europa 2018
SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment, process, and material suppliers, the other 17 wouldn’t have any...
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Seen on the Scene at Electronica 2018
This was my first Electronica, and all I can say is – It is massive. It covered everything to do with the electronics supply chain, from chip design to the chip itself, to the package, component,...
View ArticleHappy Holidays, from all the elves at 3D InCites!
The semiconductor industry could learn a few things from Santa’s elves. How about devices that package themselves? These guys may be onto something. Check it out. The post Happy Holidays, from all the...
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A Race to the Finish: Announcing the Winners of the 2019 3D InCites Awards
The 2019 3D InCites Awards vote was a nail-biter right up until the end. While some categories seemed almost predictable from start, others were neck-and-neck, with the front runner changing on a...
View ArticleThe First Decade: A Message from the Queen of 3D
Has it already been 10 years since my first business partner, Leo Archer, and I started 3D InCites? When we first conceived of the idea in 2009, I had no idea what I was getting myself into or that 10...
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Heterogenous Integration’s Star Rises at the 15th Annual IMAPS Device...
Remember when device node scaling was the semiconductor superstar, and advanced packaging was the back-up singer? At the 15th Annual IMAPS Device Packaging Conference, held March 5-7, 2019, in Fountain...
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Celebrating 25 Years of Advanced Packaging Innovation: Part 1
After spending three days in the company of the IMAPS community at the 15th annual IMAPS Device Packaging Conference (IMAPS DPC) March5-7,2019, in Fountain Hills, Arizona, I am once again reminded why...
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Celebrating 25 Years of Advanced Packaging Innovation: Part 2
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning with the establishment of 3D InCites in 2009. The first conference I...
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